OEM Modules
BT-Audio Module A1
Bluetooth 5.3 audio module for custom integrations.
SKU: CBF-MOD-A1
Wholesale FOB Pricing
On Request
Contact us for volume pricing & samples
MOQ: 5,000 units
Lead: 30 days
Key Specifications
- Chipset: Qualcomm QCC
- Profile: A2DP/HFP/AVRCP
| Chipset | Qualcomm QCC |
|---|---|
| Profile | A2DP/HFP/AVRCP |
Manufacturing Quality
Engineered for OEM/ODM partners with consistent QC, batch traceability, and compliance-ready documentation for global distribution channels.
Certifications
CE, FCC, RoHS, and Bluetooth SIG qualification support available. Request certification documents with your inquiry.
Compact PCBA module for OEM integration into custom form factors.
Order & Fulfillment
- Minimum Order
- 5,000 units
- Production Lead Time
- 30 days
- Sample Policy
- Available on request
Export Packaging
Standard export cartons with custom retail packaging, master carton labeling, and palletization available for bulk shipments. Share your destination market for optimized packing recommendations.
OEM / ODM Customization
Customize branding, acoustic tuning, firmware features, packaging, and accessory bundles for your market. Our engineering team supports full white-label programs from concept to mass production.
- Logo & colorway customization
- Custom packaging & user manual
- Firmware / app branding
- Acoustic profile tuning
- Accessory & bundle options
Send Bulk Inquiry
Request pricing, samples, or OEM customization details for BT-Audio Module A1.